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  • BGA Rework System,semi-auto machine with camera and LCD monitor;3 heaters stop PCB getting deformed, laptop, XBOX,PS2/3 repair; Specification:Upper heater: hot-air 800W; Lower heater: hot-air 800W; Bottom preheatfar infrared: 3000W; Power supply: single-phase 220V,50/60Hz,4.5KW; Workable PCB dimension: 20x20~450x400mm; Workable PCB thickness: 0.5mm ~ 3mm; Workable BGA dimension: 1x1mm ~ 70x70mm; Min pitch of BGA ball:0.15mm;Placement precision0.01mm; Max.BGA weight: 300g;.
  • Machine dimension: L700¡ÁW600¡ÁH800mm; Weight: Appox. 160Kgs; Features:The movable heating head is easy to operate; hot air head and ing head are manually controlled; PCB sliding rack is micro-adjustable with X and Y ases; Color optical system with functions such as spilt vision, zoom-in and micro-adju autofocus and menu operation, equipped with aberration detection device; Embedded industrial computer can analyze the two practically-tested profiles,.
  • and compare them with the history saved profiles;profile saving no limit for the industrial computer; Color LCD monitor, touch screen interface; Three heaters heating independently, both upper and lower heater can control multi stages on the profile simultaneously, large bottom IR heating area to heat PCB evenly; temperature, time, rate, cooling and alarm events are all displayed on the touch screen;Over-heating protection for the hot air heating head;.
  • temperature of hot air in the upper and infrared at the bottom is program controllable; 6segments of temperature up(down) and 6 segments constant temperature control, profile saving is unlimited in the industrial computer; profile analysis can be carried out on the touch screen; with computer communication function as computers, with communication software attached;with temperature measurement function;The supports for the BGA soldering supporting frame.
  • are micro-adjustable to restrain local sinkage in the soldering area; Built-in vacuum pump;60 rotating in ¦Õ angle ing nozzle is micro-adjustable. Large IR pre-heating from the bottom, made of imported high quality heater, will heat the PCB evenly to avoid deformation and keep solder effect; heating board is independently controlled; Equipped with different hot air nozzles, easy to replace and able to locate in any angle. Can handle 775 socket, 478 socket, XBOX360, PS2/3 etc.
BGA Rework System,semi-auto machine with camera and LCD monitor;3 heaters stop PCB getting deformed, laptop, XBOX,PS2/3 repair; Specification:Upper heater: hot-air 800W; Lower heater: hot-air 800W; Bottom preheatfar infrared: 3000W; Power supply: single-phase 220V,50/60Hz,4.5KW; Workable PCB dimension: 20x20~450x400mm; Workable PCB thickness: 0.5mm ~ 3mm; Workable BGA dimension: 1x1mm ~ 70x70mm; Min pitch of BGA ball:0.15mm;Placement precision0.01mm; Max.BGA weight: 300g;

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GOWE BGA Rework Station, The Best BGA Soldering Machine With Alignment System

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Disclaimer: The price shown above includes all applicable taxes and fees. The information provided above is for reference purposes only. Products may go out of stock and delivery estimates may change at any time. desertcart does not validate any claims made in the product descriptions above. For additional information, please contact the manufacturer or desertcart customer service. While desertcart makes reasonable efforts to only show products available in your country, some items may be cancelled if they are prohibited for import in Brazil. For more details, please visit our Support Page.

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